HEEPidermis

HEEPidermis Chip in TSMC 65nm LP/Christoph Thomas Müller/EPFL

Features: HEEPidermis was designed to record Galvanic Skin Response (GSR) signals. To support this functionality, it integrates: two 8-bit current Digital-to-Analog Converters (iDACs) and two digitization channels based on a VCO-based ADC.

The digitization channels can be operated independently or configured as pseudo-differential. An integrated DMA enables autonomous operation of the iDACs and ADCs. The DMA can also filter data before storage by diverting it into a Level-Crossing stream accelerator.

Design: The chip can operate as a standalone ADC with embedded feature extraction, output data via its SPI slave interface, control external ADCs via SPI, and interface with external ΔΣ ADCs through a dedicated input, where data can be decimated.

This enables flexible acquisition and processing of biosignals and other analog measurements.

HEEPidermis Test Chip layout in TSMC 65nm LP

Fabrication:

  • Technology node: TSMC 65 nm LP
  • Platform: X-HEEP MCU with analog front end

Design team: HEEPidermis is the first X-HEEP MCU extended with an analog front end. It was developed through a collaboration between the Embedded Systems Laboratory (ESL) at EPFL, Universidad Católica del Uruguay (UCU), and Politecnico di Torino.

In particular: Juan Sapriza / EPFL, Beatrice Grassano / EPFL, Alessio Naclerio / Politecnico di TorinoFilippo Quadri / EPFL, Tommaso Terzano / EPFL, David Mallasén / EPFL, Davide Schiavone / EPFL, Robin Leplae / EPFL, Jérémie Moullet / EPFL, Alexandre Levisse / EPFL, Christoph Thomas Müller / EPFL, Mariagrazia Graziano / Politecnico di Torino, Matías Miguez / Universidad Católica del Uruguay, David Atienza / EPFL.

Publication: pre-print available external page here.

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